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Flip chip
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#	Item
81	STATUS OF THE TECHNOLOGY INDUSTRY ACTIVITIES AND ACTION PLAN Add to Reading List Source URL: www.ipc.org Language: English - Date: 2010-03-15 16:01:19 Electromagnetism Surface-mount technology Printed circuit board Integrated circuit Ball grid array Rework Reflow soldering Quad Flat Package Flip chip Electronics manufacturing Electronics Electronic engineering
82	FUTURE VISIONS AND CURRENT CONCERNS SECTION 1 Add to Reading List Source URL: homepages.rpi.edu Language: English - Date: 2012-03-29 22:25:26 Microtechnology Three-dimensional integrated circuit Back end of line Wafer Very-large-scale integration Microelectromechanical systems Monocrystalline silicon Flip chip Etching Semiconductor device fabrication Electronics Technology
83	AN2920_Manf_w_LGA_working.fm Add to Reading List Source URL: www.freescale.com Language: English - Date: 2008-12-16 22:06:13 Manufacturing Surface-mount technology Solder Reflow soldering Ball grid array Rework Printed circuit board Restriction of Hazardous Substances Directive Flip chip Electronics manufacturing Electronics Electromagnetism
84	Microassembly Technologies for MEMS Michael B. Cohn¤‡, Karl F. Böhringer+º, J. Mark Noworolski¤‡, Angad Singh‡, Chris G. Keller§, Ken Y. Goldberg+, and Roger T. Howe¤‡ Add to Reading List Source URL: www.ee.washington.edu Language: English* - Date: 2003-07-05 01:01:00 Technology Microelectromechanical systems Surface micromachining Microfabrication Micro-Opto-Electro-Mechanical Systems Flip chip Integrated circuit Etching Three-dimensional integrated circuit Materials science Microtechnology Semiconductor device fabrication
85	PDF Document Add to Reading List Source URL: material.htlwien10.at Language: English - Date: 2001-07-05 08:47:30 Technology Ball grid array Surface-mount technology Flip chip Tape-automated bonding Integrated circuit Chip scale package Wire bonding Multi-chip module Electronics manufacturing Electronics Electronic engineering
86	PDF Document Add to Reading List Source URL: www.sigrity.com Language: English - Date: 2001-12-06 18:32:34 Semiconductor device fabrication Electronics manufacturing Ball grid array Integrated circuit packaging Capacitor Flip chip Bumpless Build-up Layer Integrated circuit Chip scale package Technology Electronics Electronic engineering
87	PDF Document Add to Reading List Source URL: www.innovative-dsp.com Language: English - Date: 2012-04-04 19:02:50 Semiconductor device fabrication Reconfigurable computing Field-programmable gate array Flip chip Embedded system Wire bonding Nordson Corporation Nallatech Surface-mount technology Electronic engineering Electronics Electronics manufacturing
88	PDF Document Add to Reading List Source URL: www.ipc.org Language: English - Date: 2010-03-15 16:01:19 Electromagnetism Surface-mount technology Printed circuit board Integrated circuit Ball grid array Rework Reflow soldering Quad Flat Package Flip chip Electronics manufacturing Electronics Electronic engineering
89	PDF Document Add to Reading List Source URL: www.imec.be Language: English - Date: 2004-11-10 04:21:41 Electronics manufacturing Solder Semiconductors Electronic design Flip chip Restriction of Hazardous Substances Directive Reliability Quad-flat no-leads package Creep Materials science Electronics Electronic engineering
90	PDF Document Add to Reading List Source URL: www.et-trends.com Language: English - Date: 2009-09-24 19:28:26 Electromagnetism Ball grid array Flip chip Surface-mount technology Flexible circuit Printed circuit board Solder Chip scale package Integrated circuit Electronics manufacturing Electronics Electronic engineering

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